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<title>linux/meta-intel.git/meta-haswell-wc/README, branch dylan</title>
<subtitle>[no description]</subtitle>
<id>https://git.enea.com/cgit/linux/meta-intel.git/atom?h=dylan</id>
<link rel='self' href='https://git.enea.com/cgit/linux/meta-intel.git/atom?h=dylan'/>
<link rel='alternate' type='text/html' href='https://git.enea.com/cgit/linux/meta-intel.git/'/>
<updated>2013-10-11T13:52:18+00:00</updated>
<entry>
<title>meta-haswell-wc: update README and README.sources for Dylan version</title>
<updated>2013-10-11T13:52:18+00:00</updated>
<author>
<name>Ong Boon Leong</name>
<email>boon.leong.ong@intel.com</email>
</author>
<published>2013-10-10T00:56:40+00:00</published>
<link rel='alternate' type='text/html' href='https://git.enea.com/cgit/linux/meta-intel.git/commit/?id=ff05f13b0b0512822fac9792bf0877239daf94c7'/>
<id>urn:sha1:ff05f13b0b0512822fac9792bf0877239daf94c7</id>
<content type='text'>
Update openembedded-core to use "dylan" branch.
Update broken link in README.sources.

Signed-off-by: Ong Boon Leong &lt;boon.leong.ong@intel.com&gt;
Acked-By: Nitin A Kamble &lt;nitin.a.kamble@intel.com&gt;
Signed-off-by: Tom Zanussi &lt;tom.zanussi@intel.com&gt;
</content>
</entry>
<entry>
<title>BSP READMEs: change the language of the compliance section</title>
<updated>2013-10-09T19:35:20+00:00</updated>
<author>
<name>Nitin A Kamble</name>
<email>nitin.a.kamble@intel.com</email>
</author>
<published>2013-10-09T18:13:13+00:00</published>
<link rel='alternate' type='text/html' href='https://git.enea.com/cgit/linux/meta-intel.git/commit/?id=7e03eb2132506c40cad685a805783c47c0c209d0'/>
<id>urn:sha1:7e03eb2132506c40cad685a805783c47c0c209d0</id>
<content type='text'>
Use "Yocto Project Compatible" in place of "compliance" as suggested
by Jeffrey Osier Mixon.

Signed-off-by: Nitin A Kamble &lt;nitin.a.kamble@intel.com&gt;
Signed-off-by: Tom Zanussi &lt;tom.zanussi@intel.com&gt;
</content>
</entry>
<entry>
<title>meta-haswell-wc : new BSP layer for Intel Haswell Mobile Platform</title>
<updated>2013-09-30T15:48:19+00:00</updated>
<author>
<name>Ong Boon Leong</name>
<email>boon.leong.ong@intel.com</email>
</author>
<published>2013-09-30T06:34:15+00:00</published>
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<id>urn:sha1:5e548d4cb8469599812d68eaefe5a6887cfde34a</id>
<content type='text'>
This layer provides support for 4th Gen Intel® Core™ Processor with
Mobile Intel QM87 and HM86 Chipsets.

Signed-off-by: Ong Boon Leong &lt;boon.leong.ong@intel.com&gt;
Signed-off-by: Tom Zanussi &lt;tom.zanussi@intel.com&gt;
</content>
</entry>
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