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(From OE-Core rev: 0eb139619301d0efee330932eba3617dcb39284e)
Signed-off-by: Saul Wold <sgw@linux.intel.com>
Signed-off-by: Richard Purdie <richard.purdie@linuxfoundation.org>
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TI is now maintaining an upstream x-loader git repository and
sakoman will no longer be maintained. Current upstream
includes signGP and incorporates it into the Makefile. The new
Makefile ift target builds the universal MLO binary. The armv7-a
patch is included.
Signed-off-by: Darren Hart <dvhart@linux.intel.com>
CC: Tom Zanussi <tom.zanussi@intel.com>
CC: Bruce Ashfield <bruce.ashfield@windriver.com>
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Having one monolithic packages directory makes it hard to find things
and is generally overwhelming. This commit splits it into several
logical sections roughly based on function, recipes.txt gives more
information about the classifications used.
The opportunity is also used to switch from "packages" to "recipes"
as used in OpenEmbedded as the term "packages" can be confusing to
people and has many different meanings.
Not all recipes have been classified yet, this is just a first pass
at separating things out. Some packages are moved to meta-extras as
they're no longer actively used or maintained.
Signed-off-by: Richard Purdie <rpurdie@linux.intel.com>
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