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* conf: machine: Remove all leftover config filesAndrew Davis2023-06-068-24/+0
| | | | | Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* conf: machine: j721s2-evm: Add support for J721S2 HS-FSSinthu Raja2023-03-202-0/+6
| | | | | | | | | | | | | | | Add the basic J721S2 HS-FS configuration. - Add configurations to support both HS-FS and GP keeping GP as default. - Add ti-sci-firmware overrides for HS-FS. - Remove evm conf file inclusion in hs-evm conf. - Add j721s2 hs-evm specific config to hs-evm conf. Signed-off-by: Aniket Limaye <a-limaye@ti.com> Signed-off-by: Sinthu Raja <sinthu.raja@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* am62xx-evm: Add AM62x HS-FS evm configurationChirag Shilwant2023-03-201-0/+3
| | | | | | | | | | | | | | Lets add the basic AM62x HS-FS configuration - Add machine conf for AM62x HS-FS. - The wic images will boot on AM62x HS-FS devices by default. - The sysfw image for GP and HS-SE will be packaged in the wic image as tiboot3-am62x-gp-evm.bin and tiboot3-am62x-hs-evm.bin respectively. - Add ti-sci-firmware overrides. Signed-off-by: Chirag Shilwant <c-shilwant@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* machine: Add AM62Q HS-SE evm configurationChirag Shilwant2023-03-201-0/+3
| | | | | | | | | | | | | | Lets add the basic AM62Q HS-SE configuration. - Add configurations. - Add ti-sci-firmware overrides. - Add u-boot overrides. - Add optee overrides. - Add ti-rtos-firmware overrides. Signed-off-by: Chirag Shilwant <c-shilwant@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* conf: machine: Rework do_image_wic dependenciesAndrew Davis2023-01-201-3/+0
| | | | | | | | | | | | | | | | | | The WIC image for K3 depends on the TI-SCI firmware, on AM65x and J721e also the bootloader. Make this clear by only depending on firmware in the base k3.inc file, then adding the bootloader dependency in AM65x and J721e specific includes. Remove unneeded overrides from the evm level files. Remove do_image_tar dependencies as the tar files do not include the bootloader nor TI-SCI firmware, only the boot partition of the WIC file needs these. Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* conf: machine: am64xx-evm: Switch to SR2.0 HS-FS build by defaultAndrew Davis2022-11-102-1/+4
| | | | | | | | | | | | | | | AM64x devices will only be available as SR2.0 HS-FS. Set this as the default type provided by the SDK. To allow SR2.0 HS-SE to continue to boot, like we did with GP, we add an extra machine to build SR2.0 HS-SE SYSFW. To use on SR2.0 HS-SE boards simply switch out the SYSFW image: $ cd /mnt/sd-card/boot $ mv tiboot3-am64x_sr2-hs-evm.bin tiboot3.bin Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* conf: machine: am64xx-evm: Make HS-SE the defaultAndrew Davis2022-11-101-0/+3
| | | | | | | | | | | | The HS-SE AM64xx machine can now be run on GP devices and built without needing the TI_SECURE_DEV_PKG for the same. AM64xx will only be available in the HS-FS type going forward. Make the HS-SE the default and remove the original GP machine. Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* conf: machine: am64xx-hs-evm: Add extra machine to build GP SYSFWAndrew Davis2022-11-101-0/+3
| | | | | | | | | | | | | Use multiconfig to generate a GP SYSFW image. This allows the HS SDK to be used on GP boards by simply switching out the SYSFW image: $ cd /mnt/sd-card/boot $ mv tiboot3-am64x-gp-evm.bin tiboot3.bin Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* meta-ti: create a sub-layer meta-ti-bsp from existing contentDenys Dmytriyenko2022-02-223-0/+11
Extra sub-layers will be created next and relevant content moved across them. Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>