| Commit message (Collapse) | Author | Age | Files | Lines |
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override kickstarter files
Signed-off-by: Alessio Igor Bogani <alessio.bogani@elettra.eu>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Mahesh Radhakrishnan <m-radhakrishnan2@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Nikhil Devshatwar <nikhil.nd@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Restore max_leb_cnt so that the UBI/UBIFS fits into the board flash
Signed-off-by: Jacob Stiffler <j-stiffler@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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The J721E SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable lower system costs
of automotive applications such as infotainment, cluster, premium
Audio, Gateway, industrial and a range of broad market applications.
This SoC is designed around reducing the system cost by eliminating
the need of an external system MCU and is targeted towards ASIL-B/C
certification/requirements in addition to allowing complex software
and system use-cases.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, three clusters of lockstep
capable dual Cortex-R5F MCUs, Deep-learning Matrix Multiply Accelerator(MMA),
C7x floating point Vector DSP, Two C66x floating point DSPs.
* 3D GPU PowerVR Rogue 8XE GE8430
* Vision Processing Accelerator (VPAC) with image signal processor and Depth
and Motion Processing Accelerator (DMPAC)
* Two Gigabit Industrial Communication Subsystems (ICSSG), each with dual
PRUs and dual RTUs
* Two CSI2.0 4L RX plus one CSI2.0 4L TX, one eDP/DP, One DSI Tx, and
up to two DPI interfaces.
* Integrated Ethernet switch supporting up to a total of 8 external ports in
addition to legacy Ethernet switch of up to 2 ports.
* System MMU (SMMU) Version 3.0 and advanced virtualisation
capabilities.
* Upto 4 PCIe-GEN3 controllers, 2 USB3.0 Dual-role device subsystems,
16 MCANs, 12 McASP, eMMC and SD, UFS, OSPI/HyperBus memory controller, QSPI,
I3C and I2C, eCAP/eQEP, eHRPWM, MLB among other peripherals.
* Two hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
* Configurable L3 Cache and IO-coherent architecture with high data throughput
capable distributed DMA architecture under NAVSS
* Centralized System Controller for Security, Power, and Resource
Management (DMSC)
See J721E Technical Reference Manual (SPRUIL1, May 2019)
for further details: http://www.ti.com/lit/pdf/spruil1
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Force dependency to workaround [YOCTO #13280]:
https://bugzilla.yoctoproject.org/show_bug.cgi?id=13280
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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This reverts commit c2cb48e3020459c6d426a13a7180ed26742c1579.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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This reverts commit f05488f6c0a98c4f603f638a5b74bba18415ec59.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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This reverts commit 41ae756a805946501abe0308b401362c42fe3a9e.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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This reverts commit 2f28749040692b2267cb72303365bf3d2a391fef.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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This reverts commit 517864fb4f37b424877a823da76ea7b780e5a45d.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Thanks for the feedback! Updated patch below. Changes:
- Change SERIAL_CONSOLE to new SERIAL_CONSOLES format.
- Move SPL_BINARY variable into lego-ev3 machine config
- Check for KERNEL_DEVICETREE_BUNDLE before uImage manipulation.
- Fix line wrapping errors introduced by MUA
Signed-off-by: Jeremy Grosser <jeremy@synack.me>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Use variables from u-boot recipe, makes it easy to switch between TI staging
and mainline u-boot from oe-core if someone wants to.
Use SPL_BINARY and UBOOT_SUFFIX to define IMAGE_BOOT_FILES
Signed-off-by: Khem Raj <raj.khem@gmail.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Khem Raj <raj.khem@gmail.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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There have been reports recently that am335x_beaglebone_config generates bad SPL.
Until that is debugged and fixed, use generic am335x_evm_config that covers all
AM335x platforms, including BeagleBone variants.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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