| Commit message (Collapse) | Author | Age | Files | Lines | |
|---|---|---|---|---|---|
| * | meta-haswell-wc : new BSP layer for Intel Haswell Mobile Platform | Ong Boon Leong | 2013-10-31 | 1 | -0/+17 |
| This layer provides support for 4th Gen Intel® Core™ Processor with Mobile Intel QM87 and HM86 Chipsets. Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com> Signed-off-by: Tom Zanussi <tom.zanussi@intel.com> | |||||
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index : linux/meta-intel.git | |
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